Chip/Sigill

Topic: Plasma-activation high-performance semiconductors. Super-fine wafer cleaning. Chip bonding. Gluing chips. Manufacturing semiconductors.

Non-vacuum processing – Openair® plasma unleashes new potential for the manufacture of semiconductors

Silicon wafers, chips, and high-performance semiconductors are highly sensitive electronic components. As these technologies have developed, so has low-pressure plasma technology as a manufacturing process.

The enhancement of the Openair® Plasma process under atmospheric pressure opens up entirely new possibilities, in particular for automation. A vacuum is no longer required for plasma treatment, so process flows can be greatly simplified.

More advantages of Openair® Plasma systems:

  • Super-fine cleaning (component cleaning) without damaging sensitive structures;
  • Targeted functionalization of surfaces for selective additional processing;
  • Lean process layout, noticeable cost savings; and
  • Lower error rates in bonding processes.