Chip/Sigill
Topic: Plasma-activation high-performance semiconductors. Super-fine wafer cleaning. Chip bonding. Gluing chips. Manufacturing semiconductors.
Non-vacuum processing – Openair® plasma unleashes new potential for the manufacture of semiconductors
Silicon wafers, chips, and high-performance semiconductors are highly sensitive electronic components. As these technologies have developed, so has low-pressure plasma technology as a manufacturing process.
The enhancement of the Openair® Plasma process under atmospheric pressure opens up entirely new possibilities, in particular for automation. A vacuum is no longer required for plasma treatment, so process flows can be greatly simplified.
More advantages of Openair® Plasma systems:
- Super-fine cleaning (component cleaning) without damaging sensitive structures;
- Targeted functionalization of surfaces for selective additional processing;
- Lean process layout, noticeable cost savings; and
- Lower error rates in bonding processes.