Sputtersystem Tetra 8

The TETRA 8 plasma cleaner is configured with a sputtering system for high-vacuum-based coating technology and for cleaning processes in preparation of highly pure surfaces.

Basic configuration

– Body: W 610 mm x H 1,700 mm x D 800 mm
Chamber volume: about 8 liters
– Power supply: 400 V / AC 3 phases, 16 A

Gas supply

– 3 pcs. Mass-Flow-Controller (MFCs)

Vacuum chambers

Stainless steel
rectangular with hinged door
(approx. W 160 mm x H 160 mm x D 325 mm)


– 1 sputtertable 2 ”- 3 ” + shutter
(gas mantle and inlet for reactive processes is optional)

Substrate holder

– Ø 140 mm (optional rotatable substrate heater, substrate cooling)
– Switchable as an electrode for plasma pre-treatment (cleaning,
Activating, etching)


– PC-Control (Microsoft Windows XPE)

Pressure measurement

– Baratron (for use with corrosive gases)


40 kHz: Power 0 – 500W
13.56 MHz: Power 0 – 300 W

Bias-voltage source DC or pulsed unipolar
Power max. 300 W
Voltage max. 600 V DC

All generators are continuously adjustable from 0 – 100%

Vacuum pump

– in different sizes from different manufacturers
(With active carbon filter if required)
– Turbo pump

More options

Spare parts sets, pressure gauge, corrosive gas version, gasbottle, pressure reducer, faraday box, polymerization equipment , test ink set, oxygen-generator, slow ventilation of the vacuum chamber, slow pump down of the vacuum chamber, maintenance / service, documentation in national language, installation on site.