Sputtersystem Tetra 8

The TETRA 8 plasma cleaner is configured with a sputtering system for high-vacuum-based coating technology and for cleaning processes in preparation of highly pure surfaces.

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Basic configuration

– Body: W 610 mm x H 1,700 mm x D 800 mm
– Chamber volume: about 8 liters
– Power supply: 400 V / AC 3 phases, 16 A

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Gas supply

– 3 pcs. Mass-Flow-Controller (MFCs)

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Vacuum chambers

– Stainless steel
rectangular with hinged door
(approx. W 160 mm x H 160 mm x D 325 mm)

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Sputtering

– 1 sputtertable 2 ”- 3 ” + shutter
(gas mantle and inlet for reactive processes is optional)

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Substrate holder

– Ø 140 mm (optional rotatable substrate heater, substrate cooling)
– Switchable as an electrode for plasma pre-treatment (cleaning,
Activating, etching)

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Control

– PC-Control (Microsoft Windows XPE)

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Pressure measurement

– Baratron (for use with corrosive gases)

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Generator

Frequencies:
40 kHz: Power 0 – 500W
13.56 MHz: Power 0 – 300 W

Bias-voltage source DC or pulsed unipolar
Power max. 300 W
Voltage max. 600 V DC

All generators are continuously adjustable from 0 – 100%

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Vacuum pump

– in different sizes from different manufacturers
(With active carbon filter if required)
– Turbo pump

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More options

Spare parts sets, pressure gauge, corrosive gas version, gasbottle, pressure reducer, faraday box, polymerization equipment , test ink set, oxygen-generator, slow ventilation of the vacuum chamber, slow pump down of the vacuum chamber, maintenance / service, documentation in national language, installation on site.