Following are the effects of a technical plasma:
- Stimulated atoms, radicals and ions cause very effective reactions with almost any substrate material because of their high reactivity. This effect is primarily responsible für plasma etching, plasma cleaning and plasma polymerisation.
- Ions which can be accelerated by an electric field can act similar to sandblasting in microscopic dimension because of their high kinetic energie. This effect is responsible for plasma cleaning, for plasmaetching by microsandblasting and for anisotropic ion etching.
- High energy UV-radiation is generated by recombination of ions with electrons. This high energetic radiation cracks organic molecules and produces radicals which are most effective in chemical reactions.